China’s Tencent Server Design Will Use AMD Rome

Tencent, the Chinese cloud giant, said it would use AMD’s newest Epyc processor in its internally-designed server. The design win adds further momentum to AMD’s bid to erode rival Intel Corp.

By George Leopold

Intel AI Summit: New ‘Keem Bay’ Edge VPU, AI Product Roadmap

At its AI Summit today in San Francisco, Intel touted a raft of AI training and inference hardware for deployments ranging from cloud to edge and designed to support organizations at various poin

By Doug Black

Tackling HPC’s Memory and I/O Bottlenecks with On-Node, Non-Volatile RAM

On-node, non-volatile memory (NVRAM) is a game-changing technology that can remove many I/O and memory bottlenecks and provide a key enabler for exascale. That’s the conclusion drawn by the sci

By Jan Rowell

MLPerf Releases First Inference Benchmark Results; Nvidia Touts its Showing

MLPerf.org, the young AI-benchmarking consortium, today issued the first round of results for its inference test suite. Among organizations with submissions were Nvidia, Intel, Alibaba, Supermicr

By John Russell

  • Off The Wire

  • Breaking News

HPCwire Readers' and Editors' Choice Awards

The results are in! See the full list of 2019 honorees here.

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industy updates delivered to you every week!

Nvidia Launches Credit Card-Sized 21 TOPS Jetson System for Edge Devices

November 6, 2019

Nvidia has launched a new addition to its Jetson product line: a credit card-sized (70x45mm) form factor delivering up to 21 trillion operations/second (TOPS) o Read more…

By Doug Black

AI-based Cancer Protein Simulation is Finalist for SC19 Best Paper

November 4, 2019

Accurate simulation of cancer-implicated proteins holds enormous promise for basic biomedical science and development of effective therapies, but the high compu Read more…

By John Russell

‘Electroadhesive’ Technique from MIT Could Help Build Tinier Electronics

October 28, 2019

Our lives are consumed by small electronics, like smartphones and smartwatches, from which we demand ever more power. The most intricate components of these dev Read more…

By Oliver Peckham

Micron Delivers 3D XPoint Drive, Acquires FPGA Device Maker

October 25, 2019

Micron Technology unveiled the X100, a new solid-state drive based on 3D XPoint technology that the company claims is the fastest in the world. It introduced tw Read more…

By Alex Woodie

Dell Ramps Up HPC Testing of AMD Rome Processors

October 21, 2019

Dell Technologies is wading deeper into the AMD-based systems market with a growing evaluation program for the latest Epyc (Rome) microprocessors from AMD. In a Read more…

By John Russell

Using AI to Solve One of the Most Prevailing Problems in CFD

October 17, 2019

How can artificial intelligence (AI) and high-performance computing (HPC) solve mesh generation, one of the most commonly referenced problems in computational engineering? A new study has set out to answer this question and create an industry-first AI-mesh application... Read more…

By James Sharpe

Trovares Drives Memory-Driven, Property Graph Analytics Strategy with HPE

October 10, 2019

Trovares, a high performance property graph analytics company, has partnered with HPE and its Superdome Flex memory-driven servers on a cybersecurity capability the companies say “routinely” runs near-time workloads on 24TB-capacity systems... Read more…

By Doug Black

Harvard Deploys Cannon, New Lenovo Water-Cooled HPC Cluster

October 9, 2019

Harvard's Faculty of Arts & Sciences Research Computing (FASRC) center announced a refresh of their primary HPC resource. The new cluster, called Cannon after the pioneering American astronomer Annie Jump Cannon, is supplied by Lenovo... Read more…

By Tiffany Trader

Leading Solution Providers

ISC 2019 Virtual Booth Video Tour

CRAY
CRAY
DDN
DDN
DELL EMC
DELL EMC
GOOGLE
GOOGLE
ONE STOP SYSTEMS
ONE STOP SYSTEMS
PANASAS
PANASAS
VERNE GLOBAL
VERNE GLOBAL
  • arrow
  • Click Here for More Headlines
  • arrow

Whitepaper

Manufacturing Speed and Agility Enabled by Turnkey HPC Solutions

Manufacturers face growing competition as new players enter the global market all the time. To stay ahead of rivals, manufacturers increasingly rely on digital modeling and simulation tools for product design, analysis and testing with the help of HPC and CAE. So how is HPC enabling innovation for manufacturers from small to large?

Download Whitepaper

Sponsored by ANSYS

Webinar

The Convergence of HPC and AI

In this webinar, Martijn de Vries, CTO at Bright Computing and Robert Stober, Director of Product Management at Bright Computing, discuss the convergence of HPC and AI in the context of current industry trends and practices being used by organizations. They will discuss and demonstrate the convergence of HPC and AI on a shared infrastructure using Bright auto-scaler to enable efficient use of compute resources based on workload demand and policies, and also cover how to extend HPC/A.I. infrastructure to edge locations. Don’t miss out on this opportunity to gain valuable insight into innovative ways HPC and AI are being used together today.

Watch Webinar

Sponsored by Bright Computing

SpotlightON

Popular AI Use Cases

In this SpotlightON we take a look at the fast-expanding world of AI use cases. In some sense it’s harder to identify what won’t be a potential use case for AI. Today, finance, internet commerce, healthcare, energy discovery and management, and IoT applications are all hot beds of AI development and deployment. Many more will follow. Learn how your work day and business may benefit from these experiences.

Download Compendium

Sponsored by NetApp

Advanced Scale Career Development & Workforce Enhancement Center

Featured Advanced Scale Jobs:

Receive the Monthly
Advanced Computing Job Bank Resource:

HPCwire Resource Library

HPCwire Product Showcase

Subscribe to the Monthly
Technology Product Showcase:

Do NOT follow this link or you will be banned from the site!