The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight a …
Researchers are leveraging photonics to develop and scale the hardware necessary to tackle the stringent requirements of quantum information technologies. By exploiting the properties of photonic …
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May 29, 2023
Nvidia launched a new Ethernet-based networking platform – the Nvidia Spectrum-X – that targets generative AI workloads. Based on tight coupling of the Nvi Read more…
March 1, 2023
Ayar Labs, founded in 2015, is pursuing optics as a means of driving higher interconnect speeds and efficiencies in computing. Now, the company is announcing th Read more…
October 6, 2022
In this regular feature, HPCwire highlights newly published research in the high-performance computing community and related domains. From parallel programmin Read more…
August 1, 2022
As the need for speed drives computational workloads, more standards organizations are coalescing around a standard called Compute Express Link – also known a Read more…
May 4, 2022
Intel spinoff Cornelis Networks, custodian and developer of the Omni-Path networking portfolio, is now closer to reaching its next-gen networking roadmap targets thanks to an R&D contract with the Department of Energy’s National Nuclear Security Administration (NNSA). The contract is valued at $18 million. The Next-Generation High Performance Computing Network (NG-HPCN) project brings together NNSA labs and... Read more…
April 4, 2022
Later this spring, ACES – the new ‘composable’ supercomputer being stood up at Texas A&M University – will begin granting Phase One access to early Read more…
March 22, 2022
Amid the stream of news from GTC22 today was Nvidia’s launch of a new Ethernet networking platform – Spectrum-4 – and a new 51.2 terabit Spectrum-4 Ethern Read more…
March 2, 2022
U.S. leadership computers today are giant GPU-based machines, whether you’re talking about the pre-exascale Summit supercomputer in operation today at the Oak Read more…
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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