After percolating for roughly a year, NSF has issued the next solicitation for the National Quantum Virtual Lab program — this one focused on design and implementation phases of the Quantum Qua …
Join the SC24 SCinet team in Atlanta, GA, and learn high-performance networking while you network with high-performance people! Applications close July 15. Apply Now
The CommUNITY@SC24 Profess …
In celebration of HPCwire’s 35th Anniversary, we have profiled 35 luminaries who made HPC possible. See who they are!
June 12, 2024
There are really two stories packaged in the most recent MLPerf Training 4.0 results, released today. The first, of course, is the results. Nvidia (currently Read more…
June 11, 2024
The Globus user conference, now in its 22nd year, brought together over 180 researchers, system administrators, developers, and IT leaders from 55 top research Read more…
April 25, 2024
Researchers from the Center for Quantum Information (CQI), Tsinghua University, Beijing, have reported successful development and testing of a new programmable Read more…
December 12, 2023
Ayar Labs, a company that aims to eliminate copper wires with optical technology in I/O, has promoted its CTO to lead the company. Mark Wade, who has a histo Read more…
November 30, 2023
Perhaps you have seen images of Tibetan Buddhists creating beautiful and intricate images with colored sand. These sand mandalas can take weeks to create, only Read more…
October 10, 2023
We hear a lot about quantum computers – sometimes too much – but not as much about quantum networking which will also be a critical component in making wide Read more…
June 13, 2023
Steady technical progress and continued market traction were key points of emphasis coming from the PCI-SIG Developers Conference held this week in Santa Clara. Read more…
June 7, 2023
The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight area. That number was shared by the Universal Chiplet Interconnect Express consortium last month... Read more…
As Federal agencies navigate an increasingly complex and data-driven world, learning how to get the most out of high-performance computing (HPC), artificial intelligence (AI), and machine learning (ML) technologies is imperative to their mission. These technologies can significantly improve efficiency and effectiveness and drive innovation to serve citizens' needs better. Implementing HPC and AI solutions in government can bring challenges and pain points like fragmented datasets, computational hurdles when training ML models, and ethical implications of AI-driven decision-making. Still, CTG Federal, Dell Technologies, and NVIDIA unite to unlock new possibilities and seamlessly integrate HPC capabilities into existing enterprise architectures. This integration empowers organizations to glean actionable insights, improve decision-making, and gain a competitive edge across various domains, from supply chain optimization to financial modeling and beyond.
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
© 2024 HPCwire. All Rights Reserved. A Tabor Communications Publication
HPCwire is a registered trademark of Tabor Communications, Inc. Use of this site is governed by our Terms of Use and Privacy Policy.
Reproduction in whole or in part in any form or medium without express written permission of Tabor Communications, Inc. is prohibited.