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Arm Aims to Be at the Center of Increasingly Diverse Datacenter
Arm's been riding high on the mobile market for decades now, but has struggled to make its mark on servers. But the company hopes to reverse that with some new initiatives that Arm executives add …
CXL Brings Datacenter-sized Computing with 3.0 Standard, Thinks Ahead to 4.0
A new version of a standard backed by major cloud providers and chip companies could change the way some of the world's largest datacenters and fastest supercomputers are built. The CXL Consortiu …
SC22 LIVEwire Editorial Videos
• SC Conference Chair Candace Culhane
• TACC’s Vision for Leadership Computing
• Talking Carbon-free HPC with Lancium
• Frontier: From Exasperation to Exascale
UCIe Consortium Incorporates, Nvidia and Alibaba Round Out Board
August 2, 2022
The Universal Chiplet Interconnect Express (UCIe) consortium is moving ahead with its effort to standardize a universal interconnect at the package level. The c Read more…
OpenCAPI to Be Folded into CXL
August 1, 2022
As the need for speed drives computational workloads, more standards organizations are coalescing around a standard called Compute Express Link – also known a Read more…
The Race to Ensure Post Quantum Data Security
July 21, 2022
Fault-tolerant quantum computers won’t exist for years – a decade is the most common estimate. When they do arrive, thanks to Shor’s now-famous algorithm, they will be able to crack the most widely-used encryption methods, which are based on factoring. Earlier this month, the National Institute of Standards and Technology (NIST) settled on four... Read more…
Reflecting on the 25th Anniversary of ASCI Red and Continuing Themes for Our Heterogenous Future
April 26, 2022
In the third of a series of guest posts on heterogeneous computing, James Reinders shares experiences surrounding the creation of ASCI Red and ties that system' Read more…
Industry Consortium Forms to Drive UCIe Chiplet Interconnect Standard
March 2, 2022
A new industry consortium aims to establish a die-to-die interconnect standard – Universal Chiplet Interconnect Express (UCIe) – in support of an open chipl Read more…
White House Scientific Integrity Report Addresses AI and ML Ethics
January 26, 2022
Earlier this month, the White House Office of Science and Technology Policy (OSTP) Scientific Integrity Task Force released a report titled “Protecting the In Read more…
SPEC Introduces SPEChpc 2021Suite for Heterogeneous Systems
October 28, 2021
SPEC – the Standard Performance Evaluation Company – introduced its newest benchmark suite today, SPEChpc 2021, intended to measure “intense compute paral Read more…
OpenHPC Progress Report – v2.0, More Recipes, Cloud and Arm Support, Says Schulz
October 26, 2020
Launched in late 2015 and transitioned to a Linux Foundation Project in 2016, OpenHPC has marched quietly but steadily forward. Its goal “to provide a referen Read more…
SC22 Booth Videos
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Whitepaper
A New Standard in CAE Solutions for Manufacturing
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
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Whitepaper
Porting CUDA Applications to Run on AMD GPUs
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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Sponsored by AMD
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