The first Gordon Bell Prize for Climate Modeling was presented at SC23 in Denver. The award went to a team led by Sandia National Laboratories that had developed and run a model of the global atm …
Accurately calculating interactions among electrons has been a significant obstacle to reliable material exploration and design through computer modeling. Recently, a University of Michigan-led i …
Check out our list of 108 illustrious winners across 22 different categories of HPC.
November 7, 2023
SC23 will mark the tenth anniversary of the HPC Leadership Tutorials. A decade ago, providing training for the HPC community other than for users, programmers, Read more…
October 31, 2023
This week Nvidia released a paper demonstrating how generative AI can be used in semiconductor design. Nvidia chief scientist Bill Dally announced the new paper Read more…
October 11, 2023
Financial institutions need more compute capacity when trading spikes during the day, which could be available by just flicking a switch. Gone are the days of p Read more…
October 10, 2023
We hear a lot about quantum computers – sometimes too much – but not as much about quantum networking which will also be a critical component in making wide Read more…
October 5, 2023
Somewhat quietly, while quantum hardware developers have been steadily improving today's early quantum computers (scale and error correction), developers of qua Read more…
October 3, 2023
The steady research into developing real-world applications for quantum computing is piling up interesting use cases. Today, IBM reported on work with Boeing to Read more…
September 27, 2023
It’s been a busy week for IonQ, the quantum computing start-up focused on developing trapped-ion-based systems. At the Quantum World Congress today, the compa Read more…
September 20, 2023
Intel’s sprawling, optimistic vision for the future was on full display yesterday in CEO Pat Gelsinger’s opening keynote at the Intel Innovation 2023 confer Read more…
Making the Most of Today’s Cloud-First Approach to Running HPC and AI Workloads With Penguin Scyld Cloud Central™
Bursting to cloud has long been used to complement on-premises HPC capacity to meet variable compute demands. But in today’s age of cloud, many workloads start on the cloud with little IT or corporate oversight. What is needed is a way to operationalize the use of these cloud resources so that users get the compute power they need when they need it, but with constraints that take costs and the efficient use of existing compute power into account. Download this special report to learn more about this topic.
Data center infrastructure running AI and HPC workloads requires powerful microprocessor chips and the use of CPUs, GPUs, and acceleration chips to carry out compute intensive tasks. AI and HPC processing generate excessive heat which results in higher data center power consumption and additional data center costs.
Data centers traditionally use air cooling solutions including heatsinks and fans that may not be able to reduce energy consumption while maintaining infrastructure performance for AI and HPC workloads. Liquid cooled systems will be increasingly replacing air cooled solutions for data centers running HPC and AI workloads to meet heat and performance needs.
QCT worked with Intel to develop the QCT QoolRack, a rack-level direct-to-chip cooling solution which meets data center needs with impressive cooling power savings per rack over air cooled solutions, and reduces data centers’ carbon footprint with QCT QoolRack smart management.
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