Ansys Launches 2021 R1 to Unlock Possibilities for Engineering Teams

January 26, 2021

Jan. 26, 2021 — Recently launched Ansys 2021 R1 products deliver improvements in simulation technology along with the immense compute power of high-performance computing to reimagine what is now possible for global engineering teams. Ansys’ simulation solutions offer new levels of collaboration, providing insight into product safety, reliability and performance.

Companies of every size in every industry are challenging traditional ways of working in pursuit of breakthrough innovation. The simplified workflows and unique product enhancements in Ansys 2021 R1 create opportunities for engineers to accomplish design and product development goals that were previously thought unattainable. With Ansys 2021 R1, engineers no longer need to develop workarounds because of technology limitations and make workflow compromises that increase design cost and risk.

Ansys 2021 R1 provides advancements for large electromagnetic system simulations that previously were not possible while including vendor components in those simulations with greater efficiency and scalability. These components can be encrypted, so vendors can share proprietary 3D component designs and create high-fidelity simulations.

Ansys 2021 R1 expands sensor simulation capabilities with scanning and rotating lidar models to improve AV simulation reliability.

Ansys 2021 R1 pushes semiconductor engineering boundaries, delivering comprehensive analysis of signal integrity, power integrity, thermal and mechanical stress on 3D multi-die systems. While thermo-mechanical stresses and warpage can damage 3D-IC packages, leveraging proven Ansys flagship technology enables users to increase product lifespan and reliability.

The advances in Ansys 2021 R1 coupled with Ansys Cloud drive faster simulations, simpler workflows and additional solver capabilities, making simulation accessible for companies of all sizes. Ansys Cloud improvements have empowered Ansys fluids, structures and electronics customers to quickly scale up to solve computational issues.

“With Ansys Cloud, the ability to immediately scale up machines is unparalleled,” said Benjamin Turner, mechanical engineer at Hargrove Engineers + Constructors. “It eliminates the need to install any software and delivers pure convenience. I can use my smartphone to check my simulation’s status.”

As leading companies accelerate the pace of their autonomous vehicle (AV) and electric vehicle (EV) development, safety continues to be a top priority. Ansys 2021 R1 provides a comprehensive sensor solution for AVs, including an industry-leading, real-time, physics-based radar sensor capability, combined with closed-loop simulation validation to enhance AV safety. Also, new scanning and rotating lidar models boost AV simulation reliability. Additionally, Ansys’ embedded systems and software solutions increase communication among team members and reduce embedded software certification costs. This delivers improved modeling and code generation flexibility for AUTOSAR automotive software components and provides support for the FACE 3.0 Technical Standard for military avionics. Lastly, Ansys’ cutting-edge systems safety solution helps enhance EV and AV safety analyses by graphically pinpointing where potential system failures may occur, simplifying the software safety review process.

This new release makes comprehensive development of EV components a reality. Harnessing a new battery designer tool helps engineers optimize materials selection for creating next-gen batteries, while a new EV powertrain library speeds system simulation of electrified components. New software enhancements also add alarm sounds to vehicle advanced driver assistance systems that better EV driving safety, while new battery models equip engineers to tackle different scenarios including battery crush, cooling, nail penetration and module crush.

This release drives new levels of design exploration through capabilities like automated fluid-solid thermal analysis to easily predict fluid and solid thermal behaviors for the design and evaluation of electronics cooling and heat management devices. To create their unique 3D printers, Qualup SAS leverages Ansys Discovery to visualize thermal and cooling design variations.

“Ansys Discovery allows us to quickly evaluate the influences of design variations on the thermal and internal ventilation of the print chamber as well as the influence of the design on the cooling of certain components,” said Philippe Boichut, owner, Qualup SAS. “Discovery gives us the incredible possibility to modify the modeling live and to visualize the effects instantly — a perfect tool for designers.”

About Ansys

If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you’ve used a product where Ansys software played a critical role in its creation. Ansys is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination. Founded in 1970, Ansys is headquartered south of Pittsburgh, Pennsylvania, U.S.A. Visit www.ansys.com for more information.


Source: Ansys

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