Google scientists Jeff Dean and Amin Vahdat delivered a fascinating tour of major ML hardware and software design trends in their joint Hot Chips 23 opening keynote this week. The pair tackled …
The first numbers of the available bandwidth between chiplets is out – UCIe is estimating that chiplet packages could squeeze out communication speeds of 630Gbps, or 0.63Tbps, in a very tight a …
Find out which 12 HPC luminaries are being recognized this year for driving innovation within their particular fields.
June 3, 2023
Researchers are leveraging photonics to develop and scale the hardware necessary to tackle the stringent requirements of quantum information technologies. By ex Read more…
April 19, 2023
Researchers at Meta, MIT and other institutions connected servers with a dozen Nvidia GPUs with optical switches and a robotic arm, devising a new interconnect Read more…
April 10, 2023
There are limits on the speed of how fast copper wires can move data between computers, and a transition to light speed will ultimately drive AI and high-performance computing forward. Every major chipmaker is in agreement that optical interconnects will be needed to reach zettascale computing in an energy-efficient way. That opinion was... Read more…
March 6, 2023
While quantum computing makes its way haphazardly towards practical realty, quantum key distribution (QKD) is moving quickly towards greater commercial use. Tod Read more…
March 1, 2023
Ayar Labs, founded in 2015, is pursuing optics as a means of driving higher interconnect speeds and efficiencies in computing. Now, the company is announcing th Read more…
October 18, 2022
Spun out from Google last March, SandboxAQ is a fascinating, well-funded start-up targeting the intersection of AI and quantum technology. “As the world enter Read more…
October 11, 2022
The launch of ESnet6 was announced at an event at Berkeley Lab this morning. ESnet – short for “energy sciences network” – is managed by Berkeley Lab, f Read more…
October 6, 2022
In this regular feature, HPCwire highlights newly published research in the high-performance computing community and related domains. From parallel programmin Read more…
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
Divergent Technologies developed a digital production system that can revolutionize automotive and industrial scale manufacturing. Divergent uses new manufacturing solutions and their Divergent Adaptive Production System (DAPS™) software to make vehicle manufacturing more efficient, less costly and decrease manufacturing waste by replacing existing design and production processes.
Divergent initially used on-premises workstations to run HPC simulations but faced challenges because their workstations could not achieve fast enough simulation times. Divergent also needed to free staff from managing the HPC system, CAE integration and IT update tasks.
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