October 6, 2021
Micron today introduced its 7400 series solid state drives (SSDs), a new family of fourth-generation PCIe-based NVMe devices that should give datacenter operato Read more…
March 16, 2021
After almost 10 years of investments and flagging progress, Micron announced today (Tuesday) that it is ending its involvement in 3D XPoint, the non-volatile me Read more…
November 10, 2020
The high-density 3D NAND flash memory unveiled by Micron Technology this week promises to boost storage application performance from the datacenter to the edge, Read more…
October 21, 2020
In a sign that its 3D XPoint memory technology is gaining traction, Intel Corp. is departing the NAND flash memory and storage market with the sale of its manuf Read more…
February 26, 2020
Deep learning accelerators based on chip architectures coupled with high-bandwidth memory are emerging to enable near real-time processing of machine learning a Read more…
October 25, 2019
Micron Technology unveiled the X100, a new solid-state drive based on 3D XPoint technology that the company claims is the fastest in the world. It introduced tw Read more…
May 22, 2018
Chipmakers continue to gear designs toward AI and other demanding cloud workloads that take advantage of datacenter flash storage capacity. To that end, memory Read more…
January 10, 2018
The announcement on Monday (Jan. 8) that Intel and Micron have decided to “update” – that is, end – their long-term joint development partnership for 3D Read more…
Many organizations looking to meet their CAE HPC requirements focus on the HPC on-premises hardware or cloud options. But one surprise that many find is that the bulk of their HPC total cost of ownership (TCO) comes from the complexity of integrating HPC software with CAE applications and in perfectly orchestrating the many technologies to use the hardware and CAE licenses optimally.
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