Tag: Micron
Micron Technology used last week’s Flash Memory Summit to roll out its new line of 3D XPoint memory technology jointly developed with Intel while demonstrating the technology in solid-state drives. Micron claimed its Quantx line delivers PCI Express (PCIe) SSD performance with read latencies at less than 10 microseconds and writes at less than 20 microseconds.
IBM scientists have broken new ground in the development of a phase change memory technology (PCM) that puts a target on competing 3D XPoint technology from Intel and Micron. IBM successfully stored 3 bits per cell in a 64k-cell array that had been pre-cycled 1 million times and exposed to temperatures up to 75∘C. A paper describing the advance was presented this week at the IEEE International Memory Workshop in Paris. Phase-change memory is an up-and-coming non-volatile memory technology…
In a packed session at IDF 2015 in San Francisco last week, Scott Graham, Micron’s general manager of Hybrid Memory, discussed some of the key themes occurring in the memory landscape from Micron’s perspective. “It’s an exciting time in the industry and there’s a lot going on with memory development in system architecture and software Read more…
If you’re looking to establish yourself as an HPC player, you can either develop the technology yourself or purchase an established HPC company. Today, advanced memory maker Micron went with the latter course of action by acquiring Convey Computer Corp, widely known for its deep HPC roots and track record delivering hybrid-core computing. The financial terms Read more…
As we move into the pre-exascale era, issues of power consumption, network bandwidth, I/O and other issues will continue to push increasing integration. This was a key theme during the International Supercomputing Conference this week in Germany where Intel’s Raj Hazra provided an early look into how it will integrate various pieces of the future Read more…
If we had to take a pick from some of the most compelling announcements from SC13, the news from memory vendor (although that narrow distinction may soon change) Micron about its new Automata processor is at the top of the list. While at this point there’s still enough theory to lead us to file this Read more…
With ever-mounting CPU advancements that promise superior performance, the blame for lousy delivery on those chip promises lies squarely on memory. This problem isn’t just a matter of application performance—it’s also a matter of efficiency. This week Micron with partners Intel and others, including Altera, IBM, ARM, Xilinx and others…..
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/HMC_side_view_SC12_small.jpg” alt=”” width=”95″ height=”85″ />The next-generation memory-maker Micron Technology was one of the many innovative companies demonstrating its wares on the Supercomputing Conference (SC12) show floor last November. Micron’s General Manager of Hybrid Technology Scott Graham was on hand to discuss the latest developments in their Hybrid Memory Cube (HMC) technology, a multi-chip module that aims to address one of the biggest challenges in high performance computing: scaling the memory wall.
<img style=”float: left;” src=”http://media2.hpcwire.com/hpcwire/HMC_transparent.bmp” alt=”” width=”117″ height=”91″ />Computer memory is currently undergoing something of an identity crisis. For the past 8 years, multicore microprocessors have been creating a performance discontinuity, the so-called memory wall. It’s now fairly clear that this widening gap between compute and memory performance will not be solved with conventional DRAM products. But there is one technology under development that aims to close that gap, and its first use case will likely be in the ethereal realm of supercomputing.
DRAM manufacturers gear up for DDR4.
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