Milpitas, Calif. -- California Micro Devices Corporation (CMD) introduced
a new technology for providing high-value passive solutions to Pentium,
Pentium Pro and telecommunication board level systems. It allows the
combination of thin film passive components such as resistors and capacitors
with active semiconductor components such as diodes, charge pumps, voltage
references, operational amplifiers, analog multiplexers, mixed signal
elements, and logic circuits.

  Unlike traditional thick film passive component manufacturing which uses
ceramic material for the chip substrate, CMD's process uses silicon wafer
semiconductor manufacturing technology. CMD's patented processes produce a
range of application specific network components with significant size
reduction and performance benefits for desktops, servers, notebooks, cellular
communication, networking, and portable communication devices. California
Micro Devices calls these product solutions "P/Active" or "PAC" to denote the
combination of passive and active circuitry.

  The new technology can address multiple challenges created in modern
circuitry. For example, P/Active can be applied to circuits such as SCSI
terminators where precision and higher performance termination networks need
to be combined with active switching circuitry while providing a voltage
source.

  P/Active technology also provides the benefits of higher frequency
operation to 3 GHz and above, precision ratio matching, built-in
electrostatic discharge (ESD) protection above 2,000 volts, low voltage
requirements, and integration of low current active circuits. Products will
be offered in industry standard surface mount packages.