Intel Launches $1B Fund to Build a Foundry Innovation Ecosystem

February 7, 2022

SANTA CLARA, Calif., Feb. 7, 2022 — Intel today announced a new $1 billion fund to support early-stage startups and established companies building disruptive technologies for the foundry ecosystem. A collaboration between Intel Capital and Intel Foundry Services (IFS), the fund will prioritize investments in capabilities that accelerate foundry customers’ time to market – spanning intellectual property (IP), software tools, innovative chip architectures and advanced packaging technologies. Intel also announced partnerships with several companies aligned with this fund and focused on key strategic industry inflections: enabling modular products with an open chiplet platform and supporting design approaches that leverage multiple instruction set architectures (ISAs), spanning x86, Arm and RISC-V.

With the advent of advanced 3D packaging technologies, chip architects are increasingly adopting a modular approach to design – moving from system-on-chip to system-on-package architectures. This provides a way to partition complex semiconductors into modular blocks called “chiplets.” Credit: Intel

“Foundry customers are rapidly embracing a modular design approach to differentiate their products and accelerate time to market. Intel Foundry Services is well-positioned to lead this major industry inflection. With our new investment fund and open chiplet platform, we can help drive the ecosystem to develop disruptive technologies across the full spectrum of chip architectures,” said Pat Gelsinger, Intel CEO.

How It Works

As a key part of its IDM 2.0 strategy, Intel recently established IFS to help meet the growing global demand for advanced semiconductor manufacturing. In addition to providing leading-edge packaging and process technology and committed capacity in the U.S. and Europe, IFS is positioned to offer the foundry industry’s broadest portfolio of differentiated IP, including all of the leading ISAs.

A robust ecosystem is critical to helping foundry customers bring their designs to life using IFS technologies. The new innovation fund was created to strengthen the ecosystem in three ways:

  • Equity investments in disruptive startups.
  • Strategic investments to accelerate partner scale-up.
  • Ecosystem investments to develop disruptive capabilities supporting IFS customers.

“Intel is an innovation powerhouse, but we know that not all good ideas originate from within our four walls,” said Randhir Thakur, president of Intel Foundry Services. “Innovation thrives in open and collaborative environments. This $1 billion fund in partnership with Intel Capital – a recognized leader in venture capital investing – will marshal the full resources of Intel to drive innovation in the foundry ecosystem.”

Saf Yeboah, senior vice president and chief strategy officer at Intel, said: “Intel Capital’s history and expertise are rooted in chips. Over the last 30 years, we have invested over $5 billion into 120 companies supporting the semiconductor manufacturing ecosystem, from the materials coming out of the ground to the software tools used to implement a design. Our investments, which range from pathfinding bets into early-stage companies to deeply strategic and collaborative investments, drive innovation across architecture, IP, materials, equipment and design.”

About the Open RISC-V Ecosystem

A key part of the IFS strategy is to offer a broad range of leadership IP optimized for Intel process technologies. IFS is the only foundry to offer IP optimized for all three of the industry’s leading ISAs: x86, Arm and RISC-V.

As the leading open-source ISA, RISC-V offers a level of scalability and customization that is unique in the industry. There is strong demand from foundry customers to support more RISC-V IP offerings. As part of the new innovation fund, Intel is planning investments and offerings that will strengthen the ecosystem and help drive further adoption of RISC-V. The fund will help disruptive RISC-V companies innovate faster through IFS by collaborating on technology co-optimization, prioritizing wafer shuttles, supporting customer designs, building development boards and software infrastructure and more.

Intel is joining forces with leading partners in the RISC-V ecosystem, including Andes Technology, Esperanto Technologies, SiFive and Ventana Micro Systems. IFS plans to offer a range of validated RISC-V IP cores, performance-optimized for different market segments. By partnering with leading providers, IFS will optimize IP for Intel process technologies to ensure that RISC-V runs best on IFS silicon across all types of cores, from embedded to high-performance. Three types of RISC-V offerings will be made available:

  • Partner products manufactured on IFS technologies.
  • RISC-V cores licensed as differentiated IP.
  • Chiplet building blocks based on RISC-V, leveraging advanced packaging and high-speed chip-to-chip interfaces.

See “Fact Sheet: Catalyzing the RISC-V Ecosystem” to learn more about how IFS is catalyzing the RISC-V ecosystem with leading partners.

In addition to hardware and IP, a rich open source software ecosystem is critical for accelerating the growth and adoption of the RISC-V processor and fully unlocking value for chip designers. IFS will sponsor an open-source software development platform that allows for freedom in experimentation, including partners across the ecosystem, universities and consortia. To further this program, today the company announced that it is joining RISC-V International, a global nonprofit organization supporting the free and open RISC-V instruction set architecture and extensions.

“I’m delighted that Intel, the company that pioneered the microprocessor 50 years ago, is now a member of RISC-V International,” said David Patterson, emeritus professor at University of California, Berkeley, distinguished engineer at Google and vice chair of the board for RISC-V International.

About the Open Chiplet Platform

With the advent of advanced 3D packaging technologies, chip architects are increasingly adopting a modular approach to design – moving from system-on-chip to system-on-package architectures. This provides a way to partition complex semiconductors into modular blocks called “chiplets.” Each block is customized for a particular function, providing designers incredible flexibility to mix and match the best IP and process technologies for the product application. The ability to reuse IP also shortens development cycles and reduces the time and cost of bringing a product to market.

While there are opportunities in many segments, the data center market is one of the first to adopt modular architectures. Many cloud service providers (CSPs) are looking to create customized compute machines that incorporate accelerators, with the goal of improving data center performance for workloads such as artificial intelligence. Closely integrating accelerator chiplets in the same package as a data center CPU enables significantly higher performance and reduced power compared to placing accelerator cards near CPU boards.

Truly tapping the power of modular architectures requires an open ecosystem since the approach brings together design IP and process technologies from multiple vendors. IFS is enabling this ecosystem with its open chiplet platform, co-developed with CSPs to accelerate the platform and package integration of customers’ accelerator IP. The platform will leverage Intel’s leadership packaging capabilities with IP optimized for IFS’ advanced process technologies, combined with services to accelerate customer time to market with integration and validation.

Additionally, Intel is committed to partnering with other industry leaders to develop an open standard for a die-to-die interconnect that allows chiplets to communicate with each other at high speeds. Leveraging a strong track record of widely deployed standards – such as USB, PCI Express and CXL – the industry can drive a new, open ecosystem that will enable interoperable chiplets from different foundries and process nodes to be packaged using a wide variety of technologies.

The new open chiplet platform is seeing strong momentum with customers who value the ability to rapidly integrate accelerators optimized to new and evolving data center workloads.

About Intel

Intel is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better. To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.


Source: Intel

Subscribe to HPCwire's Weekly Update!

Be the most informed person in the room! Stay ahead of the tech trends with industry updates delivered to you every week!

Atos Outlines Plans to Get Acquired, and a Path Forward

May 21, 2024

Atos – via its subsidiary Eviden – is the second major supercomputer maker outside of HPE, while others have largely dropped out. The lack of integrators and Atos' financial turmoil have the HPC market worried. If Read more…

Core42 Is Building Its 172 Million-core AI Supercomputer in Texas

May 20, 2024

UAE-based Core42 is building an AI supercomputer with 172 million cores which will become operational later this year. The system, Condor Galaxy 3, was announced earlier this year and will have 192 nodes with Cerebras Read more…

Google Announces Sixth-generation AI Chip, a TPU Called Trillium

May 17, 2024

On Tuesday May 14th, Google announced its sixth-generation TPU (tensor processing unit) called Trillium.  The chip, essentially a TPU v6, is the company's latest weapon in the AI battle with GPU maker Nvidia and clou Read more…

ISC 2024 Student Cluster Competition

May 16, 2024

The 2024 ISC 2024 competition welcomed 19 virtual (remote) and eight in-person teams. The in-person teams participated in the conference venue and, while the virtual teams competed using the Bridges-2 supercomputers at t Read more…

Grace Hopper Gets Busy with Science 

May 16, 2024

Nvidia’s new Grace Hopper Superchip (GH200) processor has landed in nine new worldwide systems. The GH200 is a recently announced chip from Nvidia that eliminates the PCI bus from the CPU/GPU communications pathway.  Read more…

Europe’s Race towards Quantum-HPC Integration and Quantum Advantage

May 16, 2024

What an interesting panel, Quantum Advantage — Where are We and What is Needed? While the panelists looked slightly weary — their’s was, after all, one of the last panels at ISC 2024 — the discussion was fascinat Read more…

Atos Outlines Plans to Get Acquired, and a Path Forward

May 21, 2024

Atos – via its subsidiary Eviden – is the second major supercomputer maker outside of HPE, while others have largely dropped out. The lack of integrators Read more…

Google Announces Sixth-generation AI Chip, a TPU Called Trillium

May 17, 2024

On Tuesday May 14th, Google announced its sixth-generation TPU (tensor processing unit) called Trillium.  The chip, essentially a TPU v6, is the company's l Read more…

Europe’s Race towards Quantum-HPC Integration and Quantum Advantage

May 16, 2024

What an interesting panel, Quantum Advantage — Where are We and What is Needed? While the panelists looked slightly weary — their’s was, after all, one of Read more…

The Future of AI in Science

May 15, 2024

AI is one of the most transformative and valuable scientific tools ever developed. By harnessing vast amounts of data and computational power, AI systems can un Read more…

Some Reasons Why Aurora Didn’t Take First Place in the Top500 List

May 15, 2024

The makers of the Aurora supercomputer, which is housed at the Argonne National Laboratory, gave some reasons why the system didn't make the top spot on the Top Read more…

ISC 2024 Keynote: High-precision Computing Will Be a Foundation for AI Models

May 15, 2024

Some scientific computing applications cannot sacrifice accuracy and will always require high-precision computing. Therefore, conventional high-performance c Read more…

Shutterstock 493860193

Linux Foundation Announces the Launch of the High-Performance Software Foundation

May 14, 2024

The Linux Foundation, the nonprofit organization enabling mass innovation through open source, is excited to announce the launch of the High-Performance Softw Read more…

ISC 2024: Hyperion Research Predicts HPC Market Rebound after Flat 2023

May 13, 2024

First, the top line: the overall HPC market was flat in 2023 at roughly $37 billion, bogged down by supply chain issues and slowed acceptance of some larger sys Read more…

Synopsys Eats Ansys: Does HPC Get Indigestion?

February 8, 2024

Recently, it was announced that Synopsys is buying HPC tool developer Ansys. Started in Pittsburgh, Pa., in 1970 as Swanson Analysis Systems, Inc. (SASI) by John Swanson (and eventually renamed), Ansys serves the CAE (Computer Aided Engineering)/multiphysics engineering simulation market. Read more…

Nvidia H100: Are 550,000 GPUs Enough for This Year?

August 17, 2023

The GPU Squeeze continues to place a premium on Nvidia H100 GPUs. In a recent Financial Times article, Nvidia reports that it expects to ship 550,000 of its lat Read more…

Comparing NVIDIA A100 and NVIDIA L40S: Which GPU is Ideal for AI and Graphics-Intensive Workloads?

October 30, 2023

With long lead times for the NVIDIA H100 and A100 GPUs, many organizations are looking at the new NVIDIA L40S GPU, which it’s a new GPU optimized for AI and g Read more…

Choosing the Right GPU for LLM Inference and Training

December 11, 2023

Accelerating the training and inference processes of deep learning models is crucial for unleashing their true potential and NVIDIA GPUs have emerged as a game- Read more…

Shutterstock 1606064203

Meta’s Zuckerberg Puts Its AI Future in the Hands of 600,000 GPUs

January 25, 2024

In under two minutes, Meta's CEO, Mark Zuckerberg, laid out the company's AI plans, which included a plan to build an artificial intelligence system with the eq Read more…

AMD MI3000A

How AMD May Get Across the CUDA Moat

October 5, 2023

When discussing GenAI, the term "GPU" almost always enters the conversation and the topic often moves toward performance and access. Interestingly, the word "GPU" is assumed to mean "Nvidia" products. (As an aside, the popular Nvidia hardware used in GenAI are not technically... Read more…

Nvidia’s New Blackwell GPU Can Train AI Models with Trillions of Parameters

March 18, 2024

Nvidia's latest and fastest GPU, codenamed Blackwell, is here and will underpin the company's AI plans this year. The chip offers performance improvements from Read more…

Some Reasons Why Aurora Didn’t Take First Place in the Top500 List

May 15, 2024

The makers of the Aurora supercomputer, which is housed at the Argonne National Laboratory, gave some reasons why the system didn't make the top spot on the Top Read more…

Leading Solution Providers

Contributors

Eyes on the Quantum Prize – D-Wave Says its Time is Now

January 30, 2024

Early quantum computing pioneer D-Wave again asserted – that at least for D-Wave – the commercial quantum era has begun. Speaking at its first in-person Ana Read more…

Shutterstock 1285747942

AMD’s Horsepower-packed MI300X GPU Beats Nvidia’s Upcoming H200

December 7, 2023

AMD and Nvidia are locked in an AI performance battle – much like the gaming GPU performance clash the companies have waged for decades. AMD has claimed it Read more…

The GenAI Datacenter Squeeze Is Here

February 1, 2024

The immediate effect of the GenAI GPU Squeeze was to reduce availability, either direct purchase or cloud access, increase cost, and push demand through the roof. A secondary issue has been developing over the last several years. Even though your organization secured several racks... Read more…

Intel Plans Falcon Shores 2 GPU Supercomputing Chip for 2026  

August 8, 2023

Intel is planning to onboard a new version of the Falcon Shores chip in 2026, which is code-named Falcon Shores 2. The new product was announced by CEO Pat Gel Read more…

The NASA Black Hole Plunge

May 7, 2024

We have all thought about it. No one has done it, but now, thanks to HPC, we see what it looks like. Hold on to your feet because NASA has released videos of wh Read more…

GenAI Having Major Impact on Data Culture, Survey Says

February 21, 2024

While 2023 was the year of GenAI, the adoption rates for GenAI did not match expectations. Most organizations are continuing to invest in GenAI but are yet to Read more…

How the Chip Industry is Helping a Battery Company

May 8, 2024

Chip companies, once seen as engineering pure plays, are now at the center of geopolitical intrigue. Chip manufacturing firms, especially TSMC and Intel, have b Read more…

Q&A with Nvidia’s Chief of DGX Systems on the DGX-GB200 Rack-scale System

March 27, 2024

Pictures of Nvidia's new flagship mega-server, the DGX GB200, on the GTC show floor got favorable reactions on social media for the sheer amount of computing po Read more…

  • arrow
  • Click Here for More Headlines
  • arrow
HPCwire