March 4, 2019
One of the most significant differentiators between HPC systems and lesser performant systems is the interconnect technology deployed. Late last month PRACE (Pa Read more…
July 19, 2018
In the competitive global HPC landscape, system and processor vendors, nations and end user sites certainly get a lot of attention--deservedly so--but more than Read more…
October 12, 2016
Industry powerhouses have joined forces to address an issue that has confounded system architects since the advent of multicore computing, one that has gained in urgency with the rising tide of big data: the need to bring balance between processing power and data access. The Gen-Z Consortium has set out to create an open, high-performance semantic fabric interconnect... Read more…
April 12, 2016
The high performance computing market is going through a technology transition – the Co-Design transition. As has already been discussed in many articles, this transition has emerged in order to solve the performance bottlenecks of today’s infrastructures and applications, performance bottlenecks that were... Read more…
December 21, 2015
Smart switches, major deployment wins, HPC Centers of Excellence, NICs with on-board FPGAs, and UCX progress were all part of Mellanox’s hectic agenda at SC15 Read more…
June 21, 2013
To wrap up ISC, we wanted to collect some general visualized trends from this year's rankings. In this visual feature, we've provided information on operating systems, key vendors, processor and interconnect technologies and more. While there are a million ways to analyze the... Read more…
June 2, 2013
With help from a draft report from Jack Dongarra of the University of Tennessee and Oak Ridge National Laboratory, who also spearheads the process of verifying the top of the pack super, we are able to share the full processor, Xeon Phi coprocessor, custom interconnect, storage and memory, as well as power and cooling information. The supercomputer out of China will be... Read more…
May 2, 2013
It's been a notable week for Intel, with the announcement of two new leadership positions, including the pushing of 30-year veteran engineer, Brian Krzanich into the top slot. With this in mind, we revisit this week's discussion led by Intel's John Hengeveld on where the trends of big data and HPC tend to converge on the interconnect and its role in... Read more…
Today, manufacturers of all sizes face many challenges. Not only do they need to deliver complex products quickly, they must do so with limited resources while continuously innovating and improving product quality. With the use of computer-aided engineering (CAE), engineers can design and test ideas for new products without having to physically build many expensive prototypes. This helps lower costs, enhance productivity, improve quality, and reduce time to market.
As the scale and scope of CAE grows, manufacturers need reliable partners with deep HPC and manufacturing expertise. Together with AMD, HPE provides a comprehensive portfolio of high performance systems and software, high value services, and an outstanding ecosystem of performance optimized CAE applications to help manufacturing customers reduce costs and improve quality, productivity, and time to market.
Read this whitepaper to learn how HPE and AMD set a new standard in CAE solutions for manufacturing and can help your organization optimize performance.
A workload-driven system capable of running HPC/AI workloads is more important than ever. Organizations face many challenges when building a system capable of running HPC and AI workloads. There are also many complexities in system design and integration. Building a workload driven solution requires expertise and domain knowledge that organizational staff may not possess.
This paper describes how Quanta Cloud Technology (QCT), a long-time Intel® partner, developed the Taiwania 2 and Taiwania 3 supercomputers to meet the research needs of the Taiwan’s academic, industrial, and enterprise users. The Taiwan National Center for High-Performance Computing (NCHC) selected QCT for their expertise in building HPC/AI supercomputers and providing worldwide end-to-end support for solutions from system design, through integration, benchmarking and installation for end users and system integrators to ensure customer success.
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