August 31, 2023
Supercomputing remains largely an on-premises affair for many reasons that include horsepower, security, and system management. Companies need more time to move Read more…
June 14, 2023
Swap out a few silicon parts, and voila, you have a spanking new chip that did not take much work to design. That is how AMD's CEO, Lisa Su described the company making of its new MI300X GPU and its 128-core Epyc chip code-named Bergamo, which is targeted at dense server chips. Read more…
January 5, 2023
At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory. Read more…
November 10, 2022
AMD’s fourth-generation Epyc processor line has arrived, starting with the “general-purpose” architecture, called “Genoa,” the successor to third-gen Eypc Milan, which debuted in March of last year. At a launch event held today in San Francisco, AMD announced the general availability of the latest Epyc CPUs with up to 96 TSMC 5nm Zen 4 cores... Read more…
March 21, 2022
Following their debut launch in November, AMD Epyc processors with 3D V-Cache technology, codenamed Milan-X, are now generally available from major system-makers as well as from cloud provider Microsoft Azure. Available in four SKUs and ranging from 16- to 64-cores, the new processors feature 768 megabytes of L3 cache... Read more…
November 8, 2021
At a virtual event this morning, AMD CEO Lisa Su unveiled the company’s latest and much-anticipated server products: the new Milan-X CPU, which leverages AMD’s new 3D V-Cache technology; and its new Instinct MI200 GPU, which provides up to 220 compute units across two Infinity Fabric-connected dies, delivering an astounding 47.9 peak double-precision teraflops. “We're in a high-performance... Read more…
March 15, 2021
At a virtual launch event held today (Monday), AMD revealed its third-generation Epyc “Milan” CPU lineup: a set of 19 SKUs -- including the flagship 64-core, 280-watt 7763 part -- aimed at HPC, enterprise and cloud workloads. Notably, the third-gen Epyc Milan chips achieve 19 percent... Read more…
November 20, 2020
A new record for HPC scaling on the public cloud has been achieved on Microsoft Azure. Led by Dr. Jer-Ming Chia, the cloud provider partnered with the Beckman I Read more…
In this era, expansion in digital infrastructure capacity is inevitable. Parallel to this, climate change consciousness is also rising, making sustainability a mandatory part of the organization’s functioning. As computing workloads such as AI and HPC continue to surge, so does the energy consumption, posing environmental woes. IT departments within organizations have a crucial role in combating this challenge. They can significantly drive sustainable practices by influencing newer technologies and process adoption that aid in mitigating the effects of climate change.
While buying more sustainable IT solutions is an option, partnering with IT solutions providers, such and Lenovo and Intel, who are committed to sustainability and aiding customers in executing sustainability strategies is likely to be more impactful.
Learn how Lenovo and Intel, through their partnership, are strongly positioned to address this need with their innovations driving energy efficiency and environmental stewardship.
Data centers are experiencing increasing power consumption, space constraints and cooling demands due to the unprecedented computing power required by today’s chips and servers. HVAC cooling systems consume approximately 40% of a data center’s electricity. These systems traditionally use air conditioning, air handling and fans to cool the data center facility and IT equipment, ultimately resulting in high energy consumption and high carbon emissions. Data centers are moving to direct liquid cooled (DLC) systems to improve cooling efficiency thus lowering their PUE, operating expenses (OPEX) and carbon footprint.
This paper describes how CoolIT Systems (CoolIT) meets the need for improved energy efficiency in data centers and includes case studies that show how CoolIT’s DLC solutions improve energy efficiency, increase rack density, lower OPEX, and enable sustainability programs. CoolIT is the global market and innovation leader in scalable DLC solutions for the world’s most demanding computing environments. CoolIT’s end-to-end solutions meet the rising demand in cooling and the rising demand for energy efficiency.
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