AMD Shows Off MI300 Chip for the First Time

January 5, 2023

At the tail end of AMD’s 75-minute CES keynote, held yesterday in Las Vegas and via livestream, CEO Lisa Su shared new details of the forthcoming MI300 chip and publicly unveiled the silicon. The MI300 (teased earlier this year) is the first to combine a CPU, GPU and memory into a single integrated design, incorporating nine 5nm chiplets that are 3D stacked on top of four 6nm chiplets with 128 gigabytes of HBM3 memory.  Read more…

AMD’s Genoa CPUs Offer Up to 96 5nm Cores Across 12 Chiplets

November 10, 2022

AMD’s fourth-generation Epyc processor line has arrived, starting with the “general-purpose” architecture, called “Genoa,” the successor to third-gen Eypc Milan, which debuted in March of last year. At a launch event held today in San Francisco, AMD announced the general availability of the latest Epyc CPUs with up to 96 TSMC 5nm Zen 4 cores... Read more…

AMD Milan-X CPU with 3D V-Cache Available in Four SKUs, Up to 64-Cores

March 21, 2022

Following their debut launch in November, AMD Epyc processors with 3D V-Cache technology, codenamed Milan-X, are now generally available from major system-makers as well as from cloud provider Microsoft Azure. Available in four SKUs and ranging from 16- to  64-cores, the new processors feature 768 megabytes of L3 cache... Read more…

AMD Launches Milan-X CPU with 3D V-Cache and Multichip Instinct MI200 GPU

November 8, 2021

At a virtual event this morning, AMD CEO Lisa Su unveiled the company’s latest and much-anticipated server products: the new Milan-X CPU, which leverages AMD’s new 3D V-Cache technology; and its new Instinct MI200 GPU, which provides up to 220 compute units across two Infinity Fabric-connected dies, delivering an astounding 47.9 peak double-precision teraflops. “We're in a high-performance... Read more…

AMD Launches Epyc ‘Milan’ with 19 SKUs for HPC, Enterprise and Hyperscale

March 15, 2021

At a virtual launch event held today (Monday), AMD revealed its third-generation Epyc “Milan” CPU lineup: a set of 19 SKUs -- including the flagship 64-core, 280-watt 7763 part --  aimed at HPC, enterprise and cloud workloads. Notably, the third-gen Epyc Milan chips achieve 19 percent... Read more…

Azure Scaled to Record 86,400 Cores for Molecular Dynamics

November 20, 2020

A new record for HPC scaling on the public cloud has been achieved on Microsoft Azure. Led by Dr. Jer-Ming Chia, the cloud provider partnered with the Beckman I Read more…

Oracle Cloud Debuts Bare Metal Instances with Up to 128 AMD Epyc Rome Cores

April 29, 2020

Oracle Cloud today launched new bare metal and virtual instances powered by AMD's second-generation Epyc "Rome" processors, intended for high-performance comput Read more…

AMD’s Q1 Sets Records and Meets Expectations, but COVID-19 Looms

April 29, 2020

AMD has reported its Q1 2020 revenue, slightly outperforming analyst expectations and dodging the first financial blows of COVID-19 to deliver $1.79 billion – a whopping 40 percent year-over-year growth in revenue, and a record for first-quarter earnings. The year-over-year growth was primarily driven by the computing and graphics segment... Read more…

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